Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11569266 | Integrated structures comprising vertical channel material and having conductively-doped semiconductor material directly against lower sidewalls of the channel material | Haitao Liu, Chandra Mouli, Justin B. Dorhout, Sanh D. Tang, Akira Goda | 2023-01-31 |