Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11818968 | Conductive interconnects suitable for utilization in integrated assemblies, and methods of forming conductive interconnects | Jordan D. Greenlee, Tao Nguyen, Aaron K. Belsher | 2023-11-14 |
| 11710710 | Microelectronic devices with a polysilicon structure adjacent a staircase structure, and related methods | Jivaan Kishore Jhothiraman, Lifang Xu | 2023-07-25 |
| 11705500 | Assemblies having conductive structures with three or more different materials | David Ross Economy, Rita J. Klein, Jordan D. Greenlee, Brenda D. Kraus, Everett A. McTeer | 2023-07-18 |
| 11646206 | Methods of forming tungsten structures | David Ross Economy, Brian Beatty, Yongjun Jeff Hu, Jordan D. Greenlee | 2023-05-09 |
| 11647633 | Methods used in forming integrated circuitry comprising a stack comprising vertically-alternating first tiers and second tiers with the stack comprising a cavity therein that comprises a stair-step structure | Jivaan Kishore Jhothiraman | 2023-05-09 |