Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11637040 | Systems and methods for mitigating crack propagation in semiconductor die manufacturing | Wei Yeeng Ng, Rajesh Balachandran, Andrew Li, Sukhdeep Kaur, Sangeetha P. Komanduri | 2023-04-25 |
| 11545391 | Conductive interconnects and methods of forming conductive interconnects | Raju Ahmed, Darin Miller, Siva Naga Sandeep Chalamalasetty, Dave Pratt, Yi Hu +3 more | 2023-01-03 |