Issued Patents 2023
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848299 | Edge-notched substrate packaging and associated systems and methods | Madison E. Wale, James L. Voelz, Dylan W. Southern | 2023-12-19 |
| 11824010 | Interposers for microelectronic devices | Chan H. Yoo | 2023-11-21 |
| 11791315 | Semiconductor assemblies including thermal circuits and methods of manufacturing the same | Chan H. Yoo, Eiichi Nakano | 2023-10-17 |
| 11791252 | Package-on-package semiconductor assemblies and methods of manufacturing the same | Jack E. Murray | 2023-10-17 |
| 11735549 | Methods and systems for manufacturing pillar structures on semiconductor devices | Suresh Yeruva, Sameer S. Vadhavkar, Adriel Jebin Jacob Jebaraj, Wayne H. Huang | 2023-08-22 |
| 11710888 | Millimeter wave antenna and EMI shielding integrated with fan-out package | — | 2023-07-25 |
| 11664291 | Semiconductor assemblies including vertically integrated circuits and methods of manufacturing the same | Chan H. Yoo | 2023-05-30 |
| 11652283 | Integrated antenna using through silicon vias | — | 2023-05-16 |
| 11631644 | High density pillar interconnect conversion with stack to substrate connection | Kyle K. Kirby, Akshay N. Singh | 2023-04-18 |
| 11588233 | Tunable integrated millimeter wave antenna using laser ablation and/or fuses | John F. Kaeding | 2023-02-21 |
| 11587912 | High density pillar interconnect conversion with stack to substrate connection | Kyle K. Kirby, Akshay N. Singh | 2023-02-21 |
| 11574820 | Semiconductor devices with flexible reinforcement structure | Chan H. Yoo | 2023-02-07 |
| 11552045 | Semiconductor assemblies with redistribution structures for die stack signal routing | Madison E. Wale, James L. Voelz, Dylan W. Southern, Dustin L. Holloway | 2023-01-10 |