Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11631644 | High density pillar interconnect conversion with stack to substrate connection | Owen R. Fay, Kyle K. Kirby | 2023-04-18 |
| 11587912 | High density pillar interconnect conversion with stack to substrate connection | Owen R. Fay, Kyle K. Kirby | 2023-02-21 |