Issued Patents 2023
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11823977 | Semiconductor devices with back-side coils for wireless signal and power coupling | — | 2023-11-21 |
| 11817305 | Front end of line interconnect structures and associated systems and methods | Kunal R. Parekh | 2023-11-14 |
| 11776926 | Combination-bonded die pair packaging and associated systems and methods | Bret K. Street | 2023-10-03 |
| 11769738 | Apparatuses exhibiting enhanced stress resistance and planarity, and related microelectronic devices and memory devices | Chao Wang | 2023-09-26 |
| 11735568 | Semiconductor die stacks and associated systems and methods | — | 2023-08-22 |
| 11735528 | Semiconductor memory stacks connected to processing units and associated systems and methods | — | 2023-08-22 |
| 11631644 | High density pillar interconnect conversion with stack to substrate connection | Owen R. Fay, Akshay N. Singh | 2023-04-18 |
| 11587912 | High density pillar interconnect conversion with stack to substrate connection | Owen R. Fay, Akshay N. Singh | 2023-02-21 |
| 11587895 | Semiconductor interconnect structures with vertically offset bonding surfaces, and associated systems and methods | — | 2023-02-21 |
| 11569203 | Multi-height interconnect structures and associated systems and methods | — | 2023-01-31 |