JM

Jack E. Murray

📍 Boise, ID: #376 of 687 inventorsTop 55%
🗺 Idaho: #554 of 1,268 inventorsTop 45%
Overall (2023): #407,891 of 537,848Top 80%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11791252 Package-on-package semiconductor assemblies and methods of manufacturing the same Owen R. Fay 2023-10-17