Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848299 | Edge-notched substrate packaging and associated systems and methods | Owen R. Fay, Madison E. Wale, James L. Voelz | 2023-12-19 |
| 11552045 | Semiconductor assemblies with redistribution structures for die stack signal routing | Owen R. Fay, Madison E. Wale, James L. Voelz, Dustin L. Holloway | 2023-01-10 |