Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817420 | Systems and methods for direct bonding in semiconductor die manufacturing | Chia-Jung Hsu | 2023-11-14 |
| 11791315 | Semiconductor assemblies including thermal circuits and methods of manufacturing the same | Chan H. Yoo, Owen R. Fay | 2023-10-17 |
| 11749608 | Device packages including redistribution layers with carbon-based conductive elements, and methods of fabrication | — | 2023-09-05 |
| 11621257 | Wafer-scale memory techniques | Brent Keeth, Bambi L DeLaRosa | 2023-04-04 |