Issued Patents 2023
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791212 | Thin die release for semiconductor device assembly | Andrew M. Bayless | 2023-10-17 |
| 11784092 | Disposing protective cover film and underfill layer over singulated integrated circuit dice for protection during integrated circuit processing | Andrew M. Bayless | 2023-10-10 |
| 11784050 | Method of fabricating microelectronic devices and related microelectronic devices, tools, and apparatus | Andrew M. Bayless | 2023-10-10 |
| 11776908 | Semiconductor die edge protection for semiconductor device assemblies and associated systems and methods | Andrew M. Bayless | 2023-10-03 |
| 11764096 | Method for semiconductor die edge protection and semiconductor die separation | Andrew M. Bayless | 2023-09-19 |
| 11715696 | Semiconductor devices with recessed pads for die stack interconnections | Ruei Ying Sheng, Andrew M. Bayless | 2023-08-01 |
| 11705425 | Thermocompression bond tips and related apparatus and methods | Benjamin L. McClain, Zhaohui Ma | 2023-07-18 |
| 11670612 | Method for solder bridging elimination for bulk solder C2S interconnects | Benjamin L. McClain, Jeremy E. Minnich, Zhaohui Ma | 2023-06-06 |
| 11646269 | Recessed semiconductor devices, and associated systems and methods | Andrew M. Bayless | 2023-05-09 |