Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11705425 | Thermocompression bond tips and related apparatus and methods | Benjamin L. McClain, Brandon P. Wirz | 2023-07-18 |
| 11670612 | Method for solder bridging elimination for bulk solder C2S interconnects | Brandon P. Wirz, Benjamin L. McClain, Jeremy E. Minnich | 2023-06-06 |