Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11670612 | Method for solder bridging elimination for bulk solder C2S interconnects | Brandon P. Wirz, Benjamin L. McClain, Zhaohui Ma | 2023-06-06 |
| 11594432 | Cold fluid semiconductor device release during pick and place operations, and associated systems and methods | Benjamin L. McClain, Travis M. Jensen | 2023-02-28 |