Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11705425 | Thermocompression bond tips and related apparatus and methods | Brandon P. Wirz, Zhaohui Ma | 2023-07-18 |
| 11670612 | Method for solder bridging elimination for bulk solder C2S interconnects | Brandon P. Wirz, Jeremy E. Minnich, Zhaohui Ma | 2023-06-06 |
| 11594432 | Cold fluid semiconductor device release during pick and place operations, and associated systems and methods | Jeremy E. Minnich, Travis M. Jensen | 2023-02-28 |