Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11715696 | Semiconductor devices with recessed pads for die stack interconnections | Andrew M. Bayless, Brandon P. Wirz | 2023-08-01 |
RS
Ruei Ying Sheng
Overall (2023): #273,256 of 537,848Top 55%
1
Patents 2023