Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791212 | Thin die release for semiconductor device assembly | Brandon P. Wirz | 2023-10-17 |
| 11784050 | Method of fabricating microelectronic devices and related microelectronic devices, tools, and apparatus | Brandon P. Wirz | 2023-10-10 |
| 11784092 | Disposing protective cover film and underfill layer over singulated integrated circuit dice for protection during integrated circuit processing | Brandon P. Wirz | 2023-10-10 |
| 11776908 | Semiconductor die edge protection for semiconductor device assemblies and associated systems and methods | Brandon P. Wirz | 2023-10-03 |
| 11764096 | Method for semiconductor die edge protection and semiconductor die separation | Brandon P. Wirz | 2023-09-19 |
| 11715696 | Semiconductor devices with recessed pads for die stack interconnections | Ruei Ying Sheng, Brandon P. Wirz | 2023-08-01 |
| 11676955 | Separation method and assembly for chip-on-wafer processing | Bradley R. Bitz | 2023-06-13 |
| 11646269 | Recessed semiconductor devices, and associated systems and methods | Brandon P. Wirz | 2023-05-09 |