Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749666 | Semiconductor die assemblies having molded underfill structures and related technology | Xiao Li | 2023-09-05 |
| 11688664 | Semiconductor device assembly with through-mold cooling channel formed in encapsulant | Xiao Li, Jaspreet S. Gandhi | 2023-06-27 |
| 11676955 | Separation method and assembly for chip-on-wafer processing | Andrew M. Bayless | 2023-06-13 |