Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776877 | Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths | Sameer S. Vadhavkar, Steven K. Groothuis, Jian Li, Jaspreet S. Gandhi, James M. Derderian +1 more | 2023-10-03 |
| 11749666 | Semiconductor die assemblies having molded underfill structures and related technology | Bradley R. Bitz | 2023-09-05 |
| 11715685 | Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systems | Shuangqiang Luo, Indra V. Chary, Nancy M. Lomeli | 2023-08-01 |
| 11688664 | Semiconductor device assembly with through-mold cooling channel formed in encapsulant | Bradley R. Bitz, Jaspreet S. Gandhi | 2023-06-27 |
| 11646286 | Processes for forming self-healing solder joints and repair of same, related solder joints, and microelectronic components, assemblies and electronic systems incorporating such solder joints | Shams U. Arifeen, Christopher Glancey, Koustav Sinha | 2023-05-09 |
| 11600630 | Integrated assemblies and methods of forming integrated assemblies | Jordan D. Greenlee, Nancy M. Lomeli, John D. Hopkins, Jiewei Chen, Indra V. Chary +5 more | 2023-03-07 |
| 11594462 | Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods | Steven K. Groothuis, Jian Li, Haojun Zhang, Paul A. Silvestri, Shijian Luo +3 more | 2023-02-28 |