Issued Patents 2023
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855002 | Warpage control in microelectronic packages, and related assemblies and methods | Christopher Glancey | 2023-12-26 |
| 11848282 | Semiconductor devices having crack-inhibiting structures | Hyunsuk Chun, Sheng-Wei Yang | 2023-12-19 |
| 11769752 | Stacked semiconductor die assemblies with substrate heat sinks and associated systems and methods | Christopher Glancey, Koustav Sinha | 2023-09-26 |
| 11728307 | Semiconductor interconnect structures with conductive elements, and associated systems and methods | Quang Nguyen, Christopher Glancey, Koustav Sinha, Chan H. Yoo | 2023-08-15 |
| 11721658 | Semiconductor device packages with angled pillars for decreasing stress | — | 2023-08-08 |
| 11688658 | Semiconductor device | Hyunsuk Chun, Chan H. Yoo, Tracy N. Tennant | 2023-06-27 |
| 11664360 | Circuit board with spaces for embedding components | Quang Nguyen, Christopher Glancey, Koustav Sinha | 2023-05-30 |
| 11646286 | Processes for forming self-healing solder joints and repair of same, related solder joints, and microelectronic components, assemblies and electronic systems incorporating such solder joints | Christopher Glancey, Koustav Sinha, Xiao Li | 2023-05-09 |
| 11616028 | Semiconductor devices having crack-inhibiting structures | Hyunsuk Chun, Sheng-Wei Yang, Keizo Kawakita | 2023-03-28 |
| 11587918 | Semiconductor devices, semiconductor device packages, electronic systems including same, and related methods | Xiaopeng Qu | 2023-02-21 |
| 11552029 | Semiconductor devices with reinforced substrates | Koustav Sinha, Christopher Glancey | 2023-01-10 |