Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776877 | Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths | Sameer S. Vadhavkar, Xiao Li, Steven K. Groothuis, Jian Li, James M. Derderian +1 more | 2023-10-03 |
| 11688664 | Semiconductor device assembly with through-mold cooling channel formed in encapsulant | Bradley R. Bitz, Xiao Li | 2023-06-27 |
| 11594462 | Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods | Steven K. Groothuis, Jian Li, Haojun Zhang, Paul A. Silvestri, Xiao Li +3 more | 2023-02-28 |