| 11844225 |
Dual hydrogen barrier layer for memory devices integrated with low density film for logic structures and methods of fabrication |
Noriyuki Sato, Niloy Mukherjee, Mauricio Manfrini, Tanay Gosavi, Rajeev Kumar Dokania +2 more |
2023-12-12 |
| 11844203 |
Conductive and insulative hydrogen barrier layer for memory devices |
Noriyuki Sato, Niloy Mukherjee, Mauricio Manfrini, Tanay Gosavi, Rajeev Kumar Dokania +2 more |
2023-12-12 |
| 11839070 |
High density dual encapsulation materials for capacitors and methods of fabrication |
Noriyuki Sato, Niloy Mukherjee, Mauricio Manfrini, Tanay Gosavi, Rajeev Kumar Dokania +2 more |
2023-12-05 |
| 11839088 |
Integrated via and bridge electrodes for memory array applications and methods of fabrication |
Noriyuki Sato, Niloy Mukherjee, Mauricio Manfrini, Tanay Gosavi, Rajeev Kumar Dokania +2 more |
2023-12-05 |
| 11832537 |
Titanium silicon nitride barrier layer |
Jae Seok Heo, Jerry Mack, Niloy Mukherjee |
2023-11-28 |
| 11769790 |
Rapid thermal annealing (RTA) methodologies for integration of perovskite-material based trench capacitors |
Niloy Mukherjee, Jason Y. Wu, Pratyush Pandey, Zeying Ren, FNU Atiquzzaman +8 more |
2023-09-26 |
| 11765908 |
Memory device fabrication through wafer bonding |
Mauricio Manfrini, Noriyuki Sato, James David Clarkson, Abel Fernandez, Niloy Mukherjee +4 more |
2023-09-19 |
| 11741428 |
Iterative monetization of process development of non-linear polar material and devices |
Sasikanth Manipatruni, Niloy Mukherjee, Noriyuki Sato, Tanay Gosavi, James David Clarkson +3 more |
2023-08-29 |
| 11587784 |
Smooth titanium nitride layers and methods of forming the same |
Sung Hoon Jung, Niloy Mukherjee, Hee Seok Kim, Kyu Jin Choi, Moonsig Joo +4 more |
2023-02-21 |