Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837549 | Power delivery for embedded bridge die utilizing trench structures | Kemal Aygun, Jianyong Xie | 2023-12-05 |
| 11817391 | Power delivery for embedded bridge die utilizing trench structures | Kemal Aygun, Jianyong Xie | 2023-11-14 |
| 11742275 | Ground via clustering for crosstalk mitigation | Kemal Aygun, Yu Zhang | 2023-08-29 |
| 11694952 | Horizontal pitch translation using embedded bridge dies | Sujit Sharan, Kemal Aygun, Yidnekachew S. Mekonnen, Zhichao Zhang, Jianyong Xie | 2023-07-04 |
| 11682613 | Package substrates with magnetic build-up layers | Kaladhar Radhakrishnan, Kemal Aygun | 2023-06-20 |
| 11621227 | Power delivery for embedded bridge die utilizing trench structures | Kemal Aygun, Jianyong Xie | 2023-04-04 |
| 11574862 | Optimal signal routing performance through dielectric material configuration designs in package substrate | Gang Duan, Kemal Aygun, Jieying Kong | 2023-02-07 |
| 11545416 | Minimization of insertion loss variation in through-silicon vias (TSVs) | Jianyong Xie, Yidnekachew S. Mekonnen, Kemal Aygun | 2023-01-03 |