Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791282 | Semiconductor package including part of underfill on portion of a molding material surrounding sides of logic chip and memory stack on interposer and method for manufacturing the same | Jaekyung Yoo, Yeongkwon Ko, Jayeon LEE, Jaeeun Lee | 2023-10-17 |
| 11791308 | Semiconductor package | Jihwan Hwang, Unbyoung Kang, Sangsick Park, Jihwan Suh, Soyoun Lee | 2023-10-17 |
| 11705323 | Wafer trimming device | Jungseok Ahn, Unbyoung Kang, Chungsun Lee | 2023-07-18 |
| 11587906 | Package structures having underfills | Jinwoo Park, Unbyoung Kang, Jongho Lee | 2023-02-21 |