Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11664290 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Wei-Lun Kane Jen, Vipul V. Mehta, Ashish Dhall +4 more | 2023-05-30 |
| 11631595 | High density organic interconnect structures | Sri Chaitra Jyotsna Chavali, Lilia May, Amanda E. Schuckman | 2023-04-18 |