Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837900 | Battery capacity representation method and related computer system | Chih-Teng Shen, Jen-Wei Kuo | 2023-12-05 |
| 11784114 | Plated metal layer in power packages | Jonathan Almeria Noquil, Makarand Ramkrishna Kulkarni, Osvaldo Jorge Lopez, Yiqi Tang, Rajen Manicon Murugan | 2023-10-10 |
| 11621232 | Semiconductor package with electromagnetic interference shielding | Jie Chen, Yiqi Tang, Rajen Manicon Murugan | 2023-04-04 |
| 11587899 | Multi-layer semiconductor package with stacked passive components | Yiqi Tang, Naweed Anjum, Michael G. Amaro | 2023-02-21 |
| 11545420 | High current packages with reduced solder layer count | Yiqi Tang, William Todd Harrison, Manu J. Prakuzhy, Rajen Manicon Murugan | 2023-01-03 |