Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735531 | Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layers | Srinivas V. Pietambaram, Sri Ranga Sai Boyapati, Robert Alan May, Kristof Darmawikarta, Kwangmo Chris Lim | 2023-08-22 |