Issued Patents 2022
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532733 | Dielectric isolation structure for multi-gate transistors | Jen-Hong Chang, Yi-Hsiu Liu, You-Ting Lin, Chih-Chung Chang, Kuo-Yi Chao +4 more | 2022-12-20 |
| 11450559 | Integrated circuit structure with backside dielectric layer having air gap | Che-Lun Chang, Wei-Yang Lee, Chia-Pin Lin | 2022-09-20 |
| 11437245 | Germanium hump reduction | Shih-Hao Fu, Hung-Ju Chou, Che-Lun Chang, Jiun-Ming Kuo, Sung-En Lin +2 more | 2022-09-06 |
| 11417767 | Semiconductor devices including backside vias and methods of forming the same | Che-Lun Chang, Wei-Yang Lee, Chia-Pin Lin | 2022-08-16 |
| 11404576 | Dielectric fin structure | Yu-Shan Lu, Chung-I Yang, Kuo-Yi Chao, Wen-Hsing Hsieh, Jiun-Ming Kuo +1 more | 2022-08-02 |
| 11374128 | Method and structure for air gap inner spacer in gate-all-around devices | Shih-Chiang Chen, Wei-Yang Lee, Chia-Pin Lin | 2022-06-28 |
| 11328959 | Semiconductor structure and related methods | Hung-Jiu Chou, Jiun-Ming Kuo | 2022-05-10 |
| 11232988 | Wavy profile mitigation | Shu-Wen Shen, You-Ting Lin, Jiun-Ming Kuo, Yi-Cheng Li, Pin-Ju Liang +1 more | 2022-01-25 |