Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11289343 | Method of gap filling using conformal deposition-annealing-etching cycle for reducing seam void and bending | De-Wei Yu, Chien-Hao Chen, Chia-Ao Chang | 2022-03-29 |
| 11232988 | Wavy profile mitigation | Shu-Wen Shen, You-Ting Lin, Jiun-Ming Kuo, Yuan-Ching Peng, Yi-Cheng Li +1 more | 2022-01-25 |