Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11289343 | Method of gap filling using conformal deposition-annealing-etching cycle for reducing seam void and bending | De-Wei Yu, Chien-Hao Chen, Pin-Ju Liang | 2022-03-29 |
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Chia-Ao Chang
Overall (2022): #503,419 of 548,613Top 95%
1
Patents 2022