DY

De-Wei Yu

TSMC: 2 patents #1,228 of 3,577Top 35%
📍 Lileng, TW: #2 of 2 inventorsTop 100%
Overall (2022): #164,714 of 548,613Top 35%
2
Patents 2022

Issued Patents 2022

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
11444173 Semiconductor device structure with salicide layer and method for forming the same Hsiang-Ku Shen, Jin-Mu Yin, Tsung-Chieh Hsiao, Chia-Lin Chuang, Li-Zhen Yu +14 more 2022-09-13
11289343 Method of gap filling using conformal deposition-annealing-etching cycle for reducing seam void and bending Chien-Hao Chen, Chia-Ao Chang, Pin-Ju Liang 2022-03-29