Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450559 | Integrated circuit structure with backside dielectric layer having air gap | Wei-Yang Lee, Chia-Pin Lin, Yuan-Ching Peng | 2022-09-20 |
| 11437245 | Germanium hump reduction | Shih-Hao Fu, Hung-Ju Chou, Jiun-Ming Kuo, Yuan-Ching Peng, Sung-En Lin +2 more | 2022-09-06 |
| 11417767 | Semiconductor devices including backside vias and methods of forming the same | Wei-Yang Lee, Chia-Pin Lin, Yuan-Ching Peng | 2022-08-16 |
| 11387109 | CMP process and methods thereof | Pin-Chuan Su, Hsin-Chieh Huang, Ming-Yuan Wu, Tzu kai Lin, Yu-Wen Wang +1 more | 2022-07-12 |
| 11316030 | Fin field-effect transistor device and method | Shiao-Shin Cheng, Ji-Yin Tsai, Yu-Lin Tsai, Hsin-Chieh Huang, Ming-Yuan Wu +4 more | 2022-04-26 |