Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11387109 | CMP process and methods thereof | Che-Lun Chang, Pin-Chuan Su, Ming-Yuan Wu, Tzu kai Lin, Yu-Wen Wang +1 more | 2022-07-12 |
| 11362037 | Integrated fan-out package | Ming-Yen Chiu, Ching Fu Chang | 2022-06-14 |
| 11322419 | Package with tilted interface between device die and encapsulating material | Ming-Yen Chiu, Ching Fu Chang | 2022-05-03 |
| 11316030 | Fin field-effect transistor device and method | Che-Lun Chang, Shiao-Shin Cheng, Ji-Yin Tsai, Yu-Lin Tsai, Ming-Yuan Wu +4 more | 2022-04-26 |
| 11282796 | Integrated fan-out package and method of fabricating the same | Ming-Yen Chiu, Ching Fu Chang | 2022-03-22 |