Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11417569 | Package structure having integrated circuit component with conductive terminals of different dimensions | — | 2022-08-16 |
| 11362037 | Integrated fan-out package | Ching Fu Chang, Hsin-Chieh Huang | 2022-06-14 |
| 11322419 | Package with tilted interface between device die and encapsulating material | Hsin-Chieh Huang, Ching Fu Chang | 2022-05-03 |
| 11282796 | Integrated fan-out package and method of fabricating the same | Ching Fu Chang, Hsin-Chieh Huang | 2022-03-22 |