Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508608 | Vacuum wafer chuck for manufacturing semiconductor devices | Chien-Fa Lee, Chin-Lin CHOU, Shang-Ying Tsai, Shou-Wen Kuo, Kuei-Sung Chang +2 more | 2022-11-22 |
| 11488848 | Integrated semiconductor die vessel processing workstations | Tsung-Sheng Kuo, Guan-Wei Huang, Chih-Hung Huang, Yang-Ann Chu, Jiun-Rong Pai | 2022-11-01 |
| 11430108 | Defect offset correction | Chien-Ko Liao, Ya Hsun Hsueh, Sheng-Hsiang Chuang, Jiun-Rong Pai, Shou-Wen Kuo | 2022-08-30 |
| 11402761 | Semiconductor lithography system and/or method | Tsiao-Chen Wu, Chi-Ming Yang | 2022-08-02 |
| 11334080 | Systems and methods for raised floor automated sensor vehicles | Cheng-Kang Hu, Cheng-Hung Chen, Yan-Han CHEN, Feng-Kuang Wu, Jiun-Rong Pai +1 more | 2022-05-17 |
| 11299302 | Integrated semiconductor die parceling platforms | Tsung-Sheng Kuo, Jiun-Rong Pai, Yang-Ann Chu, Chieh-Chun Lin, Shine CHEN | 2022-04-12 |
| 11270900 | Apparatus and method for handling wafer carrier doors | Tsung-Sheng Kuo, Yang-Ann Chu, Alan Yang, Vic Huang, Jiun-Rong Pai | 2022-03-08 |