Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11299302 | Integrated semiconductor die parceling platforms | Tsung-Sheng Kuo, Hsu-Shui Liu, Jiun-Rong Pai, Yang-Ann Chu, Shine CHEN | 2022-04-12 |
CL
Chieh-Chun Lin
Overall (2022): #497,732 of 548,613Top 95%
1
Patents 2022