Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538798 | Semiconductor package with multiple redistribution substrates | Hyeonjeong Hwang, Kyoung Lim Suk, Jaegwon Jang | 2022-12-27 |
| 11456241 | Semiconductor package | Jongyoun Kim, Yeonho Jang, Jaegwon Jang | 2022-09-27 |
| 11348864 | Redistribution substrate having redistribution pattern including via seed patterns covering bottom surface and sidewall surface of wiring conductive patterns and semiconductor package including the same | Gwangjae Jeon | 2022-05-31 |
| 11348876 | Semiconductor package and method of fabricating the same | Kyoung Lim Suk, Seung-Kwan Ryu | 2022-05-31 |
| 11282995 | Display module package | Dahye Kim, Jungho Park | 2022-03-22 |