Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508649 | Semiconductor package including substrate with outer insulating layer | Eungkyu Kim, Gwangjae Jeon | 2022-11-22 |
| 11456241 | Semiconductor package | Seokhyun Lee, Yeonho Jang, Jaegwon Jang | 2022-09-27 |
| 11437310 | Connection structure and method of forming the same | — | 2022-09-06 |
| 11387192 | Semiconductor package | — | 2022-07-12 |
| 11373954 | Semiconductor package | — | 2022-06-28 |