Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508649 | Semiconductor package including substrate with outer insulating layer | Eungkyu Kim, Jongyoun Kim | 2022-11-22 |
| 11348864 | Redistribution substrate having redistribution pattern including via seed patterns covering bottom surface and sidewall surface of wiring conductive patterns and semiconductor package including the same | Seokhyun Lee | 2022-05-31 |