Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538798 | Semiconductor package with multiple redistribution substrates | Hyeonjeong Hwang, Kyoung Lim Suk, Seokhyun Lee | 2022-12-27 |
| 11456241 | Semiconductor package | Seokhyun Lee, Jongyoun Kim, Yeonho Jang | 2022-09-27 |