Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538798 | Semiconductor package with multiple redistribution substrates | Kyoung Lim Suk, Seokhyun Lee, Jaegwon Jang | 2022-12-27 |
HH
Hyeonjeong Hwang
Overall (2022): #426,317 of 548,613Top 80%
1
Patents 2022