Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538798 | Semiconductor package with multiple redistribution substrates | Hyeonjeong Hwang, Seokhyun Lee, Jaegwon Jang | 2022-12-27 |
| 11348876 | Semiconductor package and method of fabricating the same | Seung-Kwan Ryu, Seokhyun Lee | 2022-05-31 |