Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11348876 | Semiconductor package and method of fabricating the same | Kyoung Lim Suk, Seokhyun Lee | 2022-05-31 |
| 11244904 | Semiconductor package including interposer | Yun-Seok Choi | 2022-02-08 |
| 11217503 | Semiconductor package having logic semiconductor chip and memory packages on interposer | Yang Gyoo Jung, Chul Woo Kim, Hyo-Chang Ryu, Yun-Seok Choi | 2022-01-04 |