Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11217503 | Semiconductor package having logic semiconductor chip and memory packages on interposer | Yang Gyoo Jung, Chul Woo Kim, Seung-Kwan Ryu, Yun-Seok Choi | 2022-01-04 |
HR
Hyo-Chang Ryu
Overall (2022): #425,455 of 548,613Top 80%
1
Patents 2022