Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11217503 | Semiconductor package having logic semiconductor chip and memory packages on interposer | Chul Woo Kim, Hyo-Chang Ryu, Seung-Kwan Ryu, Yun-Seok Choi | 2022-01-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11217503 | Semiconductor package having logic semiconductor chip and memory packages on interposer | Chul Woo Kim, Hyo-Chang Ryu, Seung-Kwan Ryu, Yun-Seok Choi | 2022-01-04 |