Issued Patents 2022
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488936 | Stacked silicon package assembly having vertical thermal management | Gamal Refai-Ahmed, Suresh Ramalingam, Cheang-Whang Chang | 2022-11-01 |
| 11373989 | Package integration for laterally mounted IC dies with dissimilar solder interconnects | Suresh Ramalingam | 2022-06-28 |
| 11355412 | Stacked silicon package assembly having thermal management | Gamal Refai-Ahmed, Henley Liu, Myongseob Kim, Tien-Yu Lee, Suresh Ramalingam +1 more | 2022-06-07 |
| 11315858 | Chip package assembly with enhanced solder resist crack resistance | Yu-Hsiang Sun, Suresh Ramalingam, Tien-Yu Lee | 2022-04-26 |
| 11302674 | Modular stacked silicon package assembly | Suresh Ramalingam, William E. Allaire, Hong Shi, Kerry M. Pierce | 2022-04-12 |
| 11282776 | High density routing for heterogeneous package integration | Vadim Heyfitch | 2022-03-22 |
| 11282775 | Chip package assembly with stress decoupled interconnect layer | Suresh Ramalingam | 2022-03-22 |
| 11217550 | Chip package assembly with enhanced interconnects and method for fabricating the same | Suresh Ramalingam | 2022-01-04 |