Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488936 | Stacked silicon package assembly having vertical thermal management | Gamal Refai-Ahmed, Suresh Ramalingam, Jaspreet S. Gandhi | 2022-11-01 |
| 11355412 | Stacked silicon package assembly having thermal management | Jaspreet S. Gandhi, Gamal Refai-Ahmed, Henley Liu, Myongseob Kim, Tien-Yu Lee +1 more | 2022-06-07 |