Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355412 | Stacked silicon package assembly having thermal management | Jaspreet S. Gandhi, Gamal Refai-Ahmed, Myongseob Kim, Tien-Yu Lee, Suresh Ramalingam +1 more | 2022-06-07 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355412 | Stacked silicon package assembly having thermal management | Jaspreet S. Gandhi, Gamal Refai-Ahmed, Myongseob Kim, Tien-Yu Lee, Suresh Ramalingam +1 more | 2022-06-07 |