| 11488887 |
Thermal enablement of dies with impurity gettering |
Gamal Refai-Ahmed, Boon Yong Ang, Toshiyuki Hisamura, Suresh Parameswaran, Scott McCann +1 more |
2022-11-01 |
| 11488936 |
Stacked silicon package assembly having vertical thermal management |
Gamal Refai-Ahmed, Jaspreet S. Gandhi, Cheang-Whang Chang |
2022-11-01 |
| 11476556 |
Remote active cooling heat exchanger and antenna system with the same |
Mohsen H. Mardi, Gamal Refai-Ahmed, Volker Aue |
2022-10-18 |
| 11373929 |
Thermal heat spreader plate for electronic device |
Gamal Refai-Ahmed, Chi-Yi Chao, Hoa Do, Anthony Torza, Brian D. Philofsky +1 more |
2022-06-28 |
| 11373989 |
Package integration for laterally mounted IC dies with dissimilar solder interconnects |
Jaspreet S. Gandhi |
2022-06-28 |
| 11355412 |
Stacked silicon package assembly having thermal management |
Jaspreet S. Gandhi, Gamal Refai-Ahmed, Henley Liu, Myongseob Kim, Tien-Yu Lee +1 more |
2022-06-07 |
| 11330738 |
Force balanced package mounting |
Gamal Refai-Ahmed, Chi-Yi Chao, Huayan Wang, Volker Aue |
2022-05-10 |
| 11328976 |
Three-dimensional thermal management apparatuses for electronic devices |
Gamal Refai-Ahmed, Chi-Yi Chao, Hoa Do, Anthony Torza, Brian D. Philofsky |
2022-05-10 |
| 11315858 |
Chip package assembly with enhanced solder resist crack resistance |
Yu-Hsiang Sun, Tien-Yu Lee, Jaspreet S. Gandhi |
2022-04-26 |
| 11302674 |
Modular stacked silicon package assembly |
Jaspreet S. Gandhi, William E. Allaire, Hong Shi, Kerry M. Pierce |
2022-04-12 |
| 11282775 |
Chip package assembly with stress decoupled interconnect layer |
Jaspreet S. Gandhi |
2022-03-22 |
| 11246211 |
Micro device with through PCB cooling |
Gamal Refai-Ahmed, Nagadeven Karunakaran, Hoa Do |
2022-02-08 |
| 11217550 |
Chip package assembly with enhanced interconnects and method for fabricating the same |
Jaspreet S. Gandhi |
2022-01-04 |