YS

Yu-Hsiang Sun

AM AMD: 1 patents #317 of 950Top 35%
Overall (2022): #191,025 of 548,613Top 35%
1
Patents 2022

Issued Patents 2022

Patent #TitleCo-InventorsDate
11315858 Chip package assembly with enhanced solder resist crack resistance Suresh Ramalingam, Tien-Yu Lee, Jaspreet S. Gandhi 2022-04-26