Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355412 | Stacked silicon package assembly having thermal management | Jaspreet S. Gandhi, Gamal Refai-Ahmed, Henley Liu, Myongseob Kim, Suresh Ramalingam +1 more | 2022-06-07 |
| 11315858 | Chip package assembly with enhanced solder resist crack resistance | Yu-Hsiang Sun, Suresh Ramalingam, Jaspreet S. Gandhi | 2022-04-26 |
| 11257795 | Chip-scale LED package structure | Chih-Yuan Chen, Wei-Lun Tsai, Chien-Tung Huang, Wei-Hsun Hsu, Wei-Chien HUNG | 2022-02-22 |