HS

Hong Shi

AM AMD: 1 patents #317 of 950Top 35%
Overall (2022): #429,497 of 548,613Top 80%
1
Patents 2022

Issued Patents 2022

Patent #TitleCo-InventorsDate
11302674 Modular stacked silicon package assembly Jaspreet S. Gandhi, Suresh Ramalingam, William E. Allaire, Kerry M. Pierce 2022-04-12